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And the development direction of polysulfone polyimide

by:CSSSLD     2021-02-03
PAI's strength is very good in current non reinforced plastic injection tooling, the tensile strength of 190 mpa, the bending strength of 250 mpa. 1. 8 mpa under load thermal deformation temperature of 274 ℃. PAI also has good ablation resistance and electric magnetic under high temperature, high frequency, metal and other materials have good adhesive performance. PMMI in 1. 8 mpa under load thermal deformation temperature as high as 360 ℃, PI under 550 ℃ can keep the main short-term physical properties, can be used under 330 ℃ for a long time.

basf company developed the hard foam polyether sulfone thermoplastic materials. The material has high heat distortion temperature, heat aging, low smoke density of volatile, low toxicity, hydrolysis resistance, acid and alkali resistance and other characteristics. The rigid foam with polyether sulfone resin composite materials used in the aerospace field promising. Due to the nature of the material has a hard, lightweight, can also be used for shipbuilding, trains, and parts of sporting goods.

PI is one very good heat resistance varieties in engineering plastics, some varieties can under 290 ℃ high temperature for a long time, short time under the high temperature of 490 ℃, and mechanical properties, fatigue resistance, fire resistance, dimension stability, electric performance is good, molding shrinkage of small, they can withstand oil, acid and organic solvent, alkali resistant, has excellent resistance to friction and abrasion performance. PEI has excellent good mechanical properties of melt flow, molding shrinkage rate is only 0. 5% - 0. 7%. Can be used in the injection and extrusion molding, post-processing is more easily.

molecular structure of polyimide is containing imide group of aromatic heterocyclic polymers link. The variety of polyamide with polyether amide, polyamide - Imide, gather all benzol imine four double Malay and poly (amino imide, etc. Polysulfone of excellent performance, widely used, easy processing into stable size precision products, widely used in automobile, electrical electrical, food, etc. Because of the preparation of polysulfone hollow fiber has been used in water purification equipment, the high content of chlorine in tap water can be used in the purification polysulfone hollow fiber devices.

PMMI electric performance is better than that of PAI, much less strength. PABM high temperature resistance, good electric properties, its under wide temperature range and various frequency dielectric loss tangent, no change, resistance to friction, the friction coefficient is only 0. 1 - 0. 25, abrasion value is 0. 002 - 0. 4 mm, good resistance to chemicals and the radioactive, combustibility UL94V - Level 0. 15% of the preparation of pyromellitic dianhydride 20% high viscosity polyamide acid solution, then add tertiary amine catalysts, heating precipitation, to remove the solvent, then through 300 ℃ high temperature processing, made ratio on the surface of the molding powder.

polyether sulfone development is given priority to with the copolymerization modification, the purpose is to improve the comprehensive performance and injection molding processing performance, in order to meet the demand of the market. Ici company developed the polyether sulfone copolymer/polysulfone, the percentage of different components, resin performance are also different. The copolymer has better than polysulfone thermal deformation temperature, are lower than those of polyether sulfone absorbent, has better flow processing performance, and can use the glass fiber reinforced.

by powder metallurgy method, polyimide powder add to the mold for ten min at 300 ℃, pressure again, in keeping the pressure under the condition of cooling, and the temperature lower than 200 ℃, relieve pressure, the mold can be. PEI melt polycondensation method are available, and because of this law without the use of solvent, polymer does not contain solvents, the processing and use has important significance. PEI continuous method can also be used directly on the extrusion machine manufacturing.

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